Lab
Schedule
| Week | Lab | Reports |
|---|---|---|
| 1 | No lab this week. | |
| 2 | Lab introduction | |
| 3 | Field oxidation | 1 - FOX report |
| 4 | PWELL lithography | 2 - PWELL report |
| 5 | PWELL boron diffusion: deposition PWELL boron diffusion: drive (done by TAs) |
|
| 6 | PMOS lithography | 3 - PMOS report |
| 7 | PMOS boron diffusion: deposition (done by TAs) PMOS boron diffusion: drive |
|
| 8 | NMOS lithography | 4 - NMOS report |
| 9 | NMOS boron diffusion: deposition & drive | |
| 10 | GATE lithography (done by TAs) GATE oxidation |
No interim report. Include in final report. |
| 11 | VIA lithography & metallization | 5 - Contacts report |
| 12 | Contact lithography | |
| 13 | Device characterization | Include in final report |
| 14 | Device characterization | |
| 15 | Dead week - prepare final report | |
| 16 | Finals week - submit final report | |
Notebook materials
Have these documents readily available whenever you are in lab. Print them out and put them in a notebook, if needed.
Miscellaneous lab instructions
- Filmetrics measurements
- Four-point probe measurements
- Microscope / Camera
- Parameter analyzer: diode
- Parameter analyzer: NMOS
- Parameter analyzer: BJT
- Capacitance meter
Source wafer data sheets
Be sure to look over and understand these materials before performing boron and phosphorus diffusions.